
Add to Cart
4LAYER RIGID FLEX PCB BOARD with GREEN SOLDERMASK TYPE
Base Material | Fr4+PI |
Copper Thickness | 1Oz |
Board Thickness | 1.6mm |
Min. Hole Size | 0.3mm |
Min. Line Width | 8mil |
Min. Line Spacing | 8mil |
Surface Finishing | ENIG |
is_customized | Yes |
Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Applications
Rigid flexible PCBs offer a wide array of applications, ranging from military weaponry and aerospace systems to cell phones and digital cameras. Increasingly, rigid flex board fabrication has been used in medical devices such as pacemakers for their space and weight reduction capabilities. The same advantages for rigid flex PCB usage can be applied to military weaponry and weapon control systems.
In consumer products, rigid flex doesn't just maximize space and weight but greatly improves reliability, eliminating many needs for solder joints and delicate, fragile wiring that are prone to connection issues. These are just some examples, but rigid flex PCBs can be used to benefit nearly all advanced electrical applications including testing equipment, tools and automobiles. Not sure what technology needs to be used for your project? Call our experts and we can help you figure out whether you need rigid flex, flex or HDI PCB technology.
Quick Details
Characteristics:
1. Professional PCB manufacturer.
2. PCBA,OEM,ODM service are provided.
3. Gerber file needed.
4. Products are 100% E-tested.
5. Quality guarantee and professional after-sale service
PRODUCTION CAPABILITY OF PCB | ||
PROCESS Engineer | ITEMS Item | PRODUCTION CAPABILITY Manufacturing Capability |
Laminate | Type | FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON |
Thickness | 0.2~3.2mm | |
Production Type | Layer Count | 2L-16L |
Surface Treatment | HAL,Gold Plating,Immersion Gold,OSP, Immersion Silver,Immersion Tin,Lead Free HAL | |
Cut Lamination | Max. Working Panel size | 1000×1200mm |
Inner Layer | Internal Core Thickness | 0.1~2.0mm |
Internal width/spacing | Min: 4/4mil | |
Internal Copper Thickness | 1.0~3.0oz | |
Dimension | Board Thickness Tolerance | ±10% |
Interlayer Alignment | ±3mil | |
Drilling | Manufacture Panel Size | Max: 650×560mm |
Drilling Diameter | ≧0.25mm | |
Hole Diameter Tolerance | ±0.05mm | |
Hole Position Tolerance | ±0.076mm | |
Min.Annular Ring | 0.05mm | |
PTH+Panel Plating | Hole Wall copper Thickness | ≧20um |
Uniformity | ≧90% | |
Outer Layer | Track Width | Min: 0.08mm |
Track Spacing | Min: 0.08mm | |
Pattern Plating | Finished Copper Thickness | 1oz~3oz |
EING/Flash Gold | Nickel Thickness | 2.5um~5.0um |
Gold Thickness | 0.03~0.05um | |
Solder Mask | Thickness | 15~35um |
Solder Mask Bridge | 3mil | |
Legend | Line width/Line spacing | 6/6mil |
Gold Finger | Nickel Thickness | ≧120u〞 |
Gold Thickness | 1~50u〞 | |
Hot Air Level | Tin Thickness | 100~300u〞 |
Routing | Tolerance of Dimension | ±0.1mm |
Slot Size | Min:0.4mm | |
Cutter Diameter | 0.8~2.4mm | |
Punching | Outline Tolerance | ±0.1mm |
Slot Size | Min:0.5mm | |
V-CUT | V-CUT Dimension | Min:60mm |
Angle | 15°30°45° | |
Remain Thickness Tolerance | ±0.1mm | |
Beveling | Beveling Dimension | 30~300mm |
Test | Testing Voltage | 250V |
Max.Dimension | 540×400mm | |
Impedance Control | Tolerance | ±10% |
Aspect Ration | 12:1 | |
Laser Drilling Size | 4mil(0.1mm) | |
Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering and Gold Finger Are Acceptable | |
OEM&ODM Service | Yes |
How to get quick quotation?
Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc | ||||||||||||||||||||
Step 2 Also please provide us the below details for quick quotation: | ||||||||||||||||||||
Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others | ||||||||||||||||||||
Material brand: SY / KB / Rogers (optional) | ||||||||||||||||||||
Material Specification:High Tg / copper based / aluminum based or others (optional) | ||||||||||||||||||||
Board thickness: 0.1 - 6.0 mm | ||||||||||||||||||||
Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um ) | ||||||||||||||||||||
Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin | ||||||||||||||||||||
Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc | ||||||||||||||||||||
Board size and quantity | ||||||||||||||||||||
If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.
| ||||||||||||||||||||
SAMPLE:
| ||||||||||||||||||||
|
Layer count | Sample lead time/workday | Batch lead time/workday |
1-2L | 2 | 6 |
4L | 5 | 8 |
6L | 5 | 9 |
8L | 6 | 10 |
10L | 8 | 10 |
12L | 8 | 12 |
14L | 10 | 15 |
16L | 10 | 18 |
18-40L (Up to difficulty) | at least 18 | at least 24 |
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays |
Q1: I am used to designing in metric units while the website is specified in imperial units.
A: When requesting an online quote, the quote form can handle mm units as well as inches for dimensions.
Q2: How do I specify internal cutouts/milling in my design?
A: All internal cutouts/slots/milling should be specified on the same layer is the board outline. The the minimum routable slot size is 32 mils. During order time, please state this requirement in the "Special Request" section so that our CAM engineers is aware of it. This is not something we encounter.
Q3: What are the available holes sizes?
A: 14 mils to 150 mils - 1 mil increments 150 mils to 200 mils - 5 mil increments above 200 mils - holes would be routed out We only use drills in imperial units. Files submitted in metric units (mm) would be converted to imperial units (mils) and rounded up to the next mil.
Now send us your inquiry, and you will be replied within 8 hours!
Little knowledge - Consideration about PCB fabrication
When placed an order of PCBs (printed circuit boards), you should spend time to considerate the basic factors including PCB board substrate material, layer count, board size, board thickness, copper thickness, surface finish, solder mask, silkscreen, blind vias, buried vias, through-hole plating, SMT and so on. When all the factors are checked and confirmed with the engineers, we highly recommended sample tested before the real fabrication of your PCB boards. If all things go well, fabrication could be started right away. However, it may need to do some modification if customer is not satisfied with the sample.